- All sections
- H - Electricity
- H05K - Printed circuits; casings or constructional details of electric apparatus; manufacture of assemblages of electrical components
- H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits
Patent holdings for IPC class H05K 3/40
Total number of patents in this class: 2360
10-year publication summary
|
224
|
262
|
298
|
286
|
270
|
219
|
197
|
137
|
118
|
41
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Murata Manufacturing Co., Ltd. | 22355 |
120 |
| Ibiden Co., Ltd. | 1724 |
62 |
| International Business Machines Corporation | 60644 |
59 |
| Unimicron Technology Corp. | 449 |
56 |
| Intel Corporation | 45621 |
55 |
| Raytheon Company | 8535 |
41 |
| LG Innotek Co., Ltd. | 6758 |
39 |
| Avary Holding (Shenzhen) Co., Limited. | 275 |
39 |
| Samsung Electro-mechanics Co., Ltd. | 4798 |
38 |
| Shinko Electric Industries Co., Ltd. | 1186 |
36 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
33 |
| at & S Austria Technologie & Systemtechnik Aktiengesellschaft | 427 |
27 |
| Fujikura Ltd. | 2777 |
25 |
| Robert Bosch GmbH | 40953 |
24 |
| Sumitomo Electric Industries, Ltd. | 14131 |
23 |
| HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd. | 124 |
23 |
| Samsung Electronics Co., Ltd. | 131630 |
21 |
| Dai Nippon Printing Co., Ltd. | 3891 |
20 |
| Kyocera Corporation | 12735 |
19 |
| Nitto Denko Corporation | 7879 |
16 |
| Other owners | 1584 |